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            • Enhanced Fiber’
            • FEA Interface*
            • Micromechanics Interface’
            • Moldex3D Digimat-RP
          • Advanced Analysis
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            • Stress
            • Plastification
            • Viscoelasticity (VE)
            • Advanced Hot Runner (AHR)
            • Pin Movement’
            • In-Mold Decoration (IMD)
            • Advanced Analysis – Optics
        • What is Moldex3D?
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        • Optics
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        • IC Packaging
        • Powder Injection Molding
        • RTM – Resin Transfer Molding
        • Investment Casting
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        • Multi-Component Molding (MCM) ( Insert Molding )
        • Reactive Injection Molding
        • Variotherm
        • Conformal Cooling
        • Injection Compression Molding
        • Water-Assisted Injection Molding (WAIM)
        • Co-Injection Molding
        • Bi-Injection Molding
        • Gas-Assisted Injection Molding (GAIM)
      • Foaming
        • Foam Injection Molding (FIM)
        • Chemical Foaming Molding
      • Standard Injection Molding
        • Solver Capabilities
          • Simultaneous Analysis (max.)
          • Parallel Processing (PP)
          • Material Database
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          • Transient Mold Cooling or Heating
          • Runner Balancing
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          • Rapid Temperature Cycling
          • Venting Design
          • Gate Design
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